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K6X8016T3B Family
Document Title
512Kx16 bit Low Power Full CMOS Static RAM
CMOS SRAM
Revision History
Revision No. History
0.0 0.1 Initial draft Revised - Deleted 44-TSOP2-400R package type. Finalized - Changed ICC1 from 4mA to 3mA - Changed ICC2 from 45mA to 30mA - Changed ISB1(industrial) from 30A to 15A - Changed ISB1(Automotive) from 40A to 25A
Draft Date
October 31, 2002 December 11, 2002
Remark
Preliminary Preliminary
1.0
September 16, 2003
Final
The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and products. SAMSUNG Electronics will answer to yourquestions about device. If you have any questions, please contact the SAMSUNG branch offices.
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Revision 1.0 September 2003
K6X8016T3B Family
512Kx16 bit Low Power Full CMOS Static RAM
FEATURES
* Process Technology: Full CMOS * Organization: 512K x16 * Power Supply Voltage: 2.7~3.6V * Low Data Retention Voltage: 1.5V(Min) * Three state outputs * Package Type: 44-TSOP2-400F
CMOS SRAM
GENERAL DESCRIPTION
The K6X8016T3B families are fabricated by SAMSUNGs advanced full CMOS process technology. The families support various operating temperature range for user flexibility of system design. The families also support low data retention voltage for battery back-up operation with low data retention current.
PRODUCT FAMILY
Power Dissipation Product Family K6X8016T3B-F K6X8016T3B-Q Operating Temperature Industrial(-40~85C) Automotive(-40~125C) Vcc Range Speed 551)/70ns 70ns Standby (ISB1, Max) 15A 25A Operating (ICC2, Max) 30mA PKG Type
2.7~3.6V
44-TSOP2-400F
1. This parameter is measured with 50pF test load (Vcc=3.0~3.6V).
PIN DESCRIPTION
A4 A3 A2 A1 A0 CS I/OI I/O2 I/O3 I/O4 Vcc Vss I/O5 I/O6 I/O7 I/O8 WE A18 A17 A16 A15 A14 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 A5 A6 A7 OE UB LB I/O16 I/O15 I/O14 I/O13 Vss Vcc I/O12 I/O11 I/O10 I/O9 A8 A9 A10 A11 A12 A13
FUNCTIONAL BLOCK DIAGRAM
Clk gen. Precharge circuit.
Vcc Vss Row Addresses
Row select
44-TSOP2 Forward
Memory array 1024 rows 512x16 columns
I/O1~I/O8
Data cont Data cont Data cont
I/O Circuit Column select
I/O9~I/O16
Name CS OE WE A0~A18
Function Chip Select Input Output Enable Input Write Enable Input Address Inputs
Name Vcc Vss UB LB
Function
Column Addresses
Power Ground Upper Byte(I/O9~16) Lower Byte(I/O1~8)
CS OE WE UB LB
I/O1~I/O16 Data Inputs/Outputs
Control Logic
SAMSUNG ELECTRONICS CO., LTD. reserves the right to change products and specifications without notice. 2
Revision 1.0 September 2003
K6X8016T3B Family
PRODUCT LIST
Industrial Temperature Products(-40~85C) Part Name K6X8016T3B-TF55 K6X8016T3B-TF70
1)
CMOS SRAM
Automotive Temperature Products(-40~125C) Part Name K6X8016T3B-TQ70 Function 44-TSOP2-F, 70ns, Low Power
Function 44-TSOP2-F, 55ns, Low Low Power 44-TSOP2-F, 70ns, Low Low Power
1. Operating voltage range is 3.0~3.6V
FUNCTIONAL DESCRIPTION
CS H L L L L L L L L OE X H X L L L X X X WE X H X H H H L L L LB X X H L H L L H L UB X X H H L L H L L I/O1~8 High-Z High-Z High-Z Dout High-Z Dout Din High-Z Din I/O9~16 High-Z High-Z High-Z High-Z Dout Dout High-Z Din Din Mode Deselected Output Disabled Output Disabled Lower Byte Read Upper Byte Read Word Read Lower Byte Write Upper Byte Write Word Write Power Standby Active Active Active Active Active Active Active Active
Note: X means dont care. (Must be low or high state)
ABSOLUTE MAXIMUM RATINGS1)
Item Voltage on any pin relative to Vss Voltage on Vcc supply relative to Power Dissipation Storage temperature Operating Temperature Symbol VIN,VOUT VCC PD TSTG TA Ratings -0.2 to VCC+0.3 (max. 3.9V) -0.2 to 3.9 1.0 -65 to 150 -40 to 85 -40 to 125 Unit V V W C C C Remark K6X8016T3B-F K6X8016T3B-Q
1. Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. Functional operation should be restricted to recommended operating condition. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
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K6X8016T3B Family
RECOMMENDED DC OPERATING CONDITIONS1)
Item Supply voltage Ground Input high voltage Input low voltage Symbol Vcc Vss VIH VIL Min 2.7 0 2.2 -0.33) Typ 3.0/3.3 0 -
CMOS SRAM
Max 3.6 0 Vcc+0.32) 0.6 Unit V V V V
Note: 1. Industrial Product: TA=-40 to 85C, otherwise specified. Automotive Product: TA=-40 to 125C, otherwise specified. 2. Overshoot: VCC+3.0V in case of pulse width 30ns. 3. Undershoot: -3.0V in case of pulse width 30ns. 4. Overshoot and undershoot are sampled, not 100% tested.
CAPACITANCE1) (f=1MHz, TA=25C)
Item Input capacitance Input/Output capacitance
1. Capacitance is sampled, not 100% tested
Symbol CIN CIO
Test Condition VIN=0V VIO=0V
Min -
Max 8 10
Unit pF pF
DC AND OPERATING CHARACTERISTICS
Item Input leakage current Output leakage current Operating power supply current Average operating current Output low voltage Output high voltage Standby Current(TTL) Standby Current(CMOS) Symbol ILI ILO ICC ICC1 ICC2 VOL VOH ISB ISB1 VIN=Vss to Vcc CS=VIH, OE=VIH or WE=VIL, VIO=Vss to Vcc IIO=0mA, CS=VIL, WE=VIH, VIN=VIH or VIL Cycle time=1s, 100% duty, IIO=0mA, CS0.2V, VIN0.2V or VINVCC-0.2V Cycle time=Min, IIO=0mA, 100% duty, CS=VIL, VIN=VIL or VIH IOL = 2.1mA IOH = -1.0mA CS=VIH, Other inputs=VIH or VIL CSVcc-0.2V, Other inputs=0~Vcc K6X8016T3B-F K6X8016T3B-Q Test Conditions Min -1 -1 2.4 Typ Max 1 1 2 3 30 0.4 0.4 15 25 Unit A A mA mA mA V V mA A
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K6X8016T3B Family
AC OPERATING CONDITIONS
TEST CONDITIONS(Test Load and Input/Output Reference)
Input pulse level: 0.4 to 2.2V Input rising and falling time: 5ns Input and output reference voltage:1.5V Output load(see right): CL=100pF+1TTL CL=50pF+1TTL
CMOS SRAM
CL1)
1.Including scope and jig capacitance
AC CHARACTERISTICS (VCC=2.7~3.6V, Industrial product:TA=-40 to 85C, Automotive product:TA=-40 to 125C)
Speed Bins Parameter List Symbol Min Read cycle time Address access time Chip select to output Output enable to valid output Chip select to low-Z output Read Output enable to low-Z output LB, UB enable to low-Z output Chip disable to high-Z output Output Disable to High-Z Output Output hold from address change LB, UB valid to data output UB, LB disable to high-Z output Write cycle time Chip select to end of write Address set-up time Address valid to end of write Write pulse width Write Write recovery time Write to output high-Z Data to write time overlap Data hold from write time End write to output low-Z LB, UB valid to end of write
1. Voltage range is 3.0V~3.6V for industrial product.
55ns
1)
70ns Max 55 55 25 20 20 25 20 20 Min 70 10 5 5 0 0 10 0 70 60 0 60 55 0 0 30 0 5 60 Max 70 70 35 25 25 35 25 25 -
Units
tRC tAA tCO tOE tLZ tOLZ tBLZ tHZ tOHZ tOH tBA tBHZ tWC tCW tAS tAW tWP tWR tWHZ tDW tDH tOW tBW
55 10 5 5 0 0 10 0 55 45 0 45 40 0 0 20 0 5 45
ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
DATA RETENTION CHARACTERISTICS
Item Vcc for data retention Data retention current Data retention set-up time Recovery time Symbol VDR IDR tSDR tRDR CSVcc-0.2V Vcc=1.5V, CSVcc-0.2V K6X8016T3B-F K6X8016T3B-Q See data retention waveform Test Condition Min 1.5 0 5 Typ Max 3.6 6 10 ms Unit V A
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K6X8016T3B Family
TIMING DIAGRAMS
CMOS SRAM
TIMING WAVEFORM OF READ CYCLE(1) (Address Controlled, CS=OE=VIL, WE=VIH, UB or/and LB=VIL)
tRC Address tOH Data Out Previous Data Valid tAA Data Valid
TIMING WAVEFORM OF READ CYCLE(2) (WE=VIH)
tRC Address tAA tCO tOH
CS
tHZ UB, LB tBA tBHZ OE tOLZ tBLZ tLZ Data Valid tOE tOHZ
Data out
High-Z
NOTES (READ CYCLE) 1. tHZ and tOHZ are defined as the time at which the outputs achieve the open circuit conditions and are not referenced to output voltage levels. 2. At any given temperature and voltage condition, tHZ(Max.) is less than tLZ(Min.) both for a given device and from device to device interconnection.
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K6X8016T3B Family
TIMING WAVEFORM OF WRITE CYCLE(1) (WE Controlled)
tWC Address tCW(2) CS tAW tBW tWP(1) WE tAS(3) tDW Data in High-Z tWHZ Data out Data Undefined Data Valid tOW tDH tWR(4)
CMOS SRAM
UB, LB
High-Z
TIMING WAVEFORM OF WRITE CYCLE(2) (CS Controlled)
tWC Address tAS(3) CS tAW tBW UB, LB tWP(1) WE tDW Data in Data Valid tDH tCW(2) tWR(4)
Data out
High-Z
High-Z
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Revision 1.0 September 2003
K6X8016T3B Family
TIMING WAVEFORM OF WRITE CYCLE(3) (UB, LB Controlled)
tWC Address tCW(2) CS tAW tBW UB, LB tAS(3) tWP(1) WE tDW Data in Data Valid tDH tWR(4)
CMOS SRAM
Data out
NOTES (WRITE CYCLE)
High-Z
High-Z
1. A write occurs during the overlap(tWP) of low CS and low WE. A write begins when CS goes low and WE goes low with asserting UB or LB for single byte operation or simultaneously asserting UB and LB for double byte operation. A write ends at the earliest transition when CS goes high and WE goes high. The tWP is measured from the beginning of write to the end of write. 2. tCW is measured from the CS going low to the end of write. 3. tAS is measured from the address valid to the beginning of write. 4. tWR is measured from the end of write to the address change. tWR applied in case a write ends as CS or WE going high.
DATA RETENTION WAVE FORM
CS controlled
VCC 2.7V tSDR Data Retention Mode tRDR
2.2V VDR CSVCC - 0.2V CS GND
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K6X8016T3B Family
PACKAGE DIMENSIONS
44 PIN THIN SMALL OUTLINE PACKAGE TYPE II (400F)
CMOS SRAM
Unit: millimeters(inches)
0~8 0.25 ( ) 0.010
#44
#23 0.45 ~0.75 0.018 ~ 0.030
11.760.20 0.4630.008
10.16 0.400
( 0.50 ) 0.020
#1
#22 1.000.10 0.0390.004 1.20 MAX. 0.047
0.15 0
0 + 0.1 5 - 0.0 .004 +0 02 .006 - 0.0
18.81 MAX. 0.741 18.410.10 0.7250.004
( 0.805 ) 0.032
0.35 0.10 0.0140.004
0.80 0.0315
0.05 MIN. 0.002
0.10 0.004 MAX
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Revision 1.0 September 2003

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